METHODE - 213-068-602 - 68-Pin 68-Position SMD low-profile
Special Price
$1.29
Regular Price
$2.50
READY TO SHIP - ONLY 396 LEFT IN STOCK!
SKU
22249
Methode Electronics - 213-068-602 - 68-Pin 68-Position SMD Low-Profile
Methode has designed this PLCC socket to take full advantage of surface mount technology. The exclusive visible internal solder tails along with the use of quality high temperature materials assure compatibility with all common reflow processes. This unique configuration combines the handling and real estate advantages of the J-lead with the processing, inspection and repair advantages of the gull wing. The small overall package dimensions allow the use of sockets with minimum sacrifice in space. A center pad is provided in insure structural integrity and provide a surface for vacuum pick up or adhesive bonding. The socket uses the same board pattern as the standard JEDEC chip and the exposed tails insure full cleaning with maximum drainage. The exclusive high pressure contact system eliminates the need for gold plating while assuring a reliable, cost effective way to provide a surface mount socket for lead chip carriers.IC Socket Type: PLCC
Termination Style: Solder
IC Type: PLCC
MPN: 213068602, 213-068-602
Brand: Methode
Type: PLCC
Contact Material: Beryllium Copper
Contact Plating: Tin/Lead over Nickel
Insulator Material: Polyphenylene Sulfide, UL 94V-0
Operating Temperature: -50°C to +125°C
Body Material: Polyphenylene Sulfide (PPS)
Termination Type: Press-Fit
Number of Pins: 68 (17x4)
Nominal Pitch Spacing: 0.100"
Features: Female, High Quality
Country/Region of Manufacture: United States
Additional Info: https://octopart.com/datasheet/213-068-602-methode-6459712
| SKU | 22249 |
|---|---|
| Condition | NS - NEW SURPLUS |
| Part Number | 213-068-602 |
| Alternative Part Number | 4-313 |
Methode Electronics - 213-068-602 - 68-Pin 68-Position SMD Low-Profile
Methode has designed this PLCC socket to take full advantage of surface mount technology. The exclusive visible internal solder tails along with the use of quality high temperature materials assure compatibility with all common reflow processes. This unique configuration combines the handling and real estate advantages of the J-lead with the processing, inspection and repair advantages of the gull wing. The small overall package dimensions allow the use of sockets with minimum sacrifice in space. A center pad is provided in insure structural integrity and provide a surface for vacuum pick up or adhesive bonding. The socket uses the same board pattern as the standard JEDEC chip and the exposed tails insure full cleaning with maximum drainage. The exclusive high pressure contact system eliminates the need for gold plating while assuring a reliable, cost effective way to provide a surface mount socket for lead chip carriers.IC Socket Type: PLCC
Termination Style: Solder
IC Type: PLCC
MPN: 213068602, 213-068-602
Brand: Methode
Type: PLCC
Contact Material: Beryllium Copper
Contact Plating: Tin/Lead over Nickel
Insulator Material: Polyphenylene Sulfide, UL 94V-0
Operating Temperature: -50°C to +125°C
Body Material: Polyphenylene Sulfide (PPS)
Termination Type: Press-Fit
Number of Pins: 68 (17x4)
Nominal Pitch Spacing: 0.100"
Features: Female, High Quality
Country/Region of Manufacture: United States
Additional Info: https://octopart.com/datasheet/213-068-602-methode-6459712
